With this particular bonder (4123) the
wirebonds are formed by thermosonic compression.
These pages are written & maintained by Adrian Boland-Thoms
Kulicke & Soffa Wirebonder 4524
University of Essex Nanofab
These pages provide an overview of the semiconductor device research and teaching nanofabrication facilities
With this particular bonder (4123) the
wirebonds are formed by thermosonic compression.
These pages are written & maintained by Adrian Boland-Thoms
Kulicke & Soffa Wirebonder 4524